cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 1/8 MTP4409H8 cystek product specification p-channel logic level enhancement mode power mosfet MTP4409H8 bv dss -30v i d -15a 7.3m v gs =-10v, i d =-15a r dson(typ) v gs =-4.5v, i d =-10a 11m description the MTP4409H8 is a p-channel enhancement-mode mo sfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. features ? single drive requirement ? low on-resistance ? fast switching characteristic ? dynamic dv/dt rating ? repetitive avalanche rated ? pb-free lead plating and halogen-free package symbol outline MTP4409H8 edfn56 pin 1 g gate d drain s source
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 2/8 MTP4409H8 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage v ds -30 gate-source voltage v gs 20 v continuous drain current @ t c =25 c, v gs =-10v -63 continuous drain current @ t c =100c, v gs =-10v i d -40 continuous drain current @ t a =25 c, v gs =-10v -15 *3 continuous drain current @ t a =70 c, v gs =-10v i dsm -12 *3 pulsed drain current i dm -200 *1,2 avalanche current i as -15 a avalanche energy @ l=0.5mh, i d =-15a, r g =25 e as 56 mj t c =25 50 t c =100 p d 20 t a =25 c 2.5 *3 total power dissipation t a =70 c p dsm 1.6 *3 w operating junction and storage te mperature range tj, tstg -55~+150 c thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 2.5 c/w thermal resistance, junction-to-ambient, max r th,j-a 50 *3 c/w note : 1. pulse width limited by maximum junction temperature. 2. duty cycle 1%. 3. surface mounted on 1 in2 copper pad of fr-4 board; 125 c/w at minimum pad. characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss -30 - - v v gs =0, i d =-250 a v gs(th) -1 -1.5 -3.0 v v ds = v gs , i d =-250 a g fs *1 - 25 - s v ds =-5v, i d =-15a i gss - - 100 na v gs = 20 - - -1 v ds =-30v, v gs =0 i dss - - -25 a v ds =-24v, v gs =0, tj=125 c - 7.3 9.5 m v gs =-10v, i d =-15a r ds(on) *1 - 11 17 m v gs =-4.5v, i d =-10a dynamic ciss - 4342 - coss - 374 - crss - 306 - pf v ds =-25v,v gs =0v, f=1mhz
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 3/8 MTP4409H8 cystek product specification characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions qg *1, 2 - 78.3 - qgs *1, 2 - 17.6 - qgd *1, 2 - 18 - nc v ds =-15v, v gs =-10v, i d =-15a t d(on) *1, 2 - 27 - tr *1, 2 - 18 - t d(off) *1, 2 - 140 - t f *1, 2 - 50 - ns v ds =-15v, i d =-1a, v gs =-10v, r g =6 source-drain diode i s *1 - - -15 i sm *3 - - -60 a v sd *1 - -0.80 -1 v i s =-10a, v gs =0v trr - 45 - ns qrr - 38 - nc i f =-15a, di f /dt=100a/ s note : *1.pulse test : pulse width 300 s, duty cycle 2% *2.independent of operating temperature *3.pulse width limited by maximum junction temperature. ordering information device package shipping dfn5 6 MTP4409H8 3000 pcs / tape & reel (pb-free lead plating an d halogen-free package) recommended soldering footprint unit : mm
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 4/8 MTP4409H8 cystek product specification typical characteristics typical output characteristics 0 20 40 60 80 100 120 140 160 180 200 024681 0 brekdown voltage vs ambient temperature 0.4 0.6 0.8 1 1.2 1.4 -100 -50 0 50 100 150 200 tj, junction temperature(c) -bv dss , normalized drain-source breakdown voltage i d =-250 a, v gs =0v -v ds , drain-source voltage(v) -i d , drain current(a) 10 v 9v 8v 7v 6v -v gs =5v -v gs =4v -v gs =3v -v =2v gs static drain-source on-state resistance vs drain current 1 10 100 1000 0.01 0.1 1 10 100 -i d , drain current(a) r ds( on) , static drain-source on-state resistance(m) v gs =-2.5v v gs =-3v v gs =-4.5v v gs =-10v reverse drain current vs source-drain voltage 0.2 0.4 0.6 0.8 1 1.2 024681 -i dr , reverse drain current(a) -v sd , source-drain voltage(v) 0 tj=25c tj=150c v gs =0v static drain-source on-state resistance vs gate-source voltage 0 40 80 120 160 200 024681 0 drain-source on-state resistance vs junction tempearture 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) r ds( on) , normalized static drain- source on-state resistance v gs =-4.5v, i d =-10a v gs =-10v, i d =-15a -v gs , gate-source voltage(v) r ds( on) , static drain-source on- state resistance(m) i d =-15a
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 5/8 MTP4409H8 cystek product specification typical characteristics(cont.) capacitance vs drain-to-source voltage 100 1000 10000 0.1 1 10 100 -v ds , drain-source voltage(v) capacitance---(pf) c oss ciss crss threshold voltage vs junction tempearture 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) -v gs( th) , normalized threshold voltage i d =-250 a forward transfer admittance vs drain current 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100 -i d , drain current(a) g fs , forward transfer admittance(s) v ds =-10v pulsed ta=25c gate charge characteristics 0 2 4 6 8 10 0 20406080 qg, total gate charge(nc) -v gs , gate-source voltage(v) v ds =-15v i d =-15a maximum safe operating area 0.01 0.1 1 10 100 1000 0.01 0.1 1 10 100 -v ds , drain-source voltage(v) -i d , drain current (a) dc 10ms 100m 1ms 100 s r dson limited t a =25c, v gs =-10v,tj=150c r ja =50c/w, single pulse 1s single pulse maximum power dissipation 0 50 100 150 200 250 300 350 0.0001 0.001 0.01 0.1 1 10 100 1000 pulse width(s) power (w) t j(max) =150c t a =25c ja =50c/w
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 6/8 MTP4409H8 cystek product specification typical characteristics(cont.) typical transfer characteristics 0 40 80 120 160 200 0123456 -v gs , gate-source voltage(v) -i d , drain current(a) v ds =-10v power derating curve 0 10 20 30 40 50 60 0 20 40 60 80 100 120 140 160 t c , case temperature() p d , power dissipation(w) transient thermal response curves 0.001 0.01 0.1 1 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 t 1 , square wave pulse duration(s) r(t), normalized effective transient thermal resistance single pulse 0.01 0.02 0.05 0.1 0.2 d=0.5 1.r ja (t)=r(t)*r ja 2.duty factor, d=t1/t2 3.t jm -t a =p dm *r ja (t) 4.r ja =50c/w
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 7/8 MTP4409H8 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c808h8 issued date : 2013.09.02 revised date : page no. : 8/8 MTP4409H8 cystek product specification dfn5 6 dimension marking : 8-lead dfn5 6 plastic package cys package code : h8 date code device name 4409 millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 0.900 1.000 0.035 0.039 k 1.190 1.390 0.047 0.055 a3 0.254 ref 0.010 ref b 0.350 0.450 0.014 0.018 d 4.944 5.096 0.195 0.201 e 1.270 typ. 0.050 typ. e 5.974 6.126 0.235 0.241 l 0.559 0.711 0.022 0.028 d1 3.910 4.110 0.154 0.162 l1 0.424 0.576 0.017 0.023 e1 3.375 3.575 0.133 0.141 h 0.574 0.726 0.023 0.029 d2 4.824 4.976 0.190 0.196 10 12 10 12 e2 5.674 5.826 0.223 0.229 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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